The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8633580 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 21, 2014

Filed:

Aug. 08, 2012
Applicants:

Richard P. Volant, New Fairfield, CT (US);

Mukta G. Farooq, Hopewell Junction, NY (US);

Kevin S. Petrarca, Newburgh, NY (US);

Inventors:

Richard P. Volant, New Fairfield, CT (US);

Mukta G. Farooq, Hopewell Junction, NY (US);

Kevin S. Petrarca, Newburgh, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

A microelectronic assembly having a through hole extending through a first wafer (or chip) and a second wafer (or chip) are provided. The first and second wafers (or chips) have confronting faces and metallic features at the faces which are joined together to assemble the first and second wafers (or chips) leaving a gap between the confronting faces. A hole is etched in the first wafer (or chip), then material is sputtered to form a wall of material in the gap between wafers (or chips). Etching continues to extend the hole into or through the second wafer (or chip). The hole is filled to form a substantially vertical through silicon conductive via.


Find Patent Forward Citations

Volant, Richard. (2014). Integrated void fill for through silicon via (U.S. Patent No. 8633580). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8633580

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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