The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Nov. 10, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Mukta G. Farooq, Hopewell Junction, NY (US);

John A. Griesemer, Salt Point, NY (US);

Gary Lafontant, Elmont, NY (US);

Kevin S. Petrarca, Newburgh, NY (US);

Richard P. Volant, New Fairfield, CT (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 21/44 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 21/76877 (2013.01);
Abstract

Method of forming a capture pad on a semiconductor substrate. The method includes providing a semiconductor substrate having an active side and an inactive side and having a plurality of unfilled TSVs extending between the active side and the inactive side; filling the TSVs with a metal; defining capture pad areas on at least one of the active side and the inactive side adjacent to the TSVs, the defined capture pad areas comprising insulator islands and open areas; filling the open areas with the same metal to form a capture pad in direct contact with each of the TSVs, each of the capture pads having an all metal portion that follows an outline of each of the TSVs.


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