The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Feb. 26, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Mutka G. Farooq, Hopewell Junction, NY (US);

Thomas F. Houghton, Hopewell Junction, NY (US);

Nitin Parbhoo, Hopewell Junction, NY (US);

Richard P. Volant, Hopewell Junction, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/18 (2006.01); B32B 27/08 (2006.01); B32B 3/02 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
B32B 37/1292 (2013.01); H01L 21/187 (2013.01); B32B 27/08 (2013.01); B32B 3/02 (2013.01);
Abstract

A layer of polymer material is applied on a peripheral region of at least one of the two substrates to be bonded prior to bonding. The bonded structure formed thereby includes a first substrate, a second substrate in direct contact with the first substrate, and a ring of the polymer material in direct contact with the first substrate at a first interface and in direct contact with the second substrate. The ring of polymer material laterally surrounds and seals the interface at which the first substrate contacts the second substrate. A ring-shaped cavity can be formed within the polymeric ring. Alternately, the first interface and the second interface can be contiguous without a ring-shaped cavity between the first and second substrates.


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