Nitin H Parbhoo

Title: Nitin H Parbhoo: Innovator in Bonded Substrate Technology

Introduction

Nitin H Parbhoo is a notable inventor based in Wappingers Falls, NY (US). He has made significant contributions to the field of bonded substrates, holding a total of 3 patents. His work focuses on innovative solutions that enhance the performance and durability of bonded materials.

Latest Patents

One of Nitin's latest patents is for a polymeric edge seal for bonded substrates. This invention involves applying a layer of polymer material on the peripheral region of at least one of the two substrates before bonding. The resulting bonded structure includes a first substrate and a second substrate in direct contact with the first. A ring of polymer material surrounds and seals the interface where the two substrates meet. This design can also accommodate a ring-shaped cavity within the polymeric ring, or the interfaces can be contiguous without such a cavity.

Career Highlights

Nitin H Parbhoo is currently employed at International Business Machines Corporation (IBM), where he continues to develop innovative technologies. His expertise in polymeric materials and bonding techniques has positioned him as a key player in his field.

Collaborations

Throughout his career, Nitin has collaborated with esteemed colleagues such as Thomas F Houghton and Richard Paul Volant. These partnerships have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Nitin H Parbhoo's work in bonded substrate technology exemplifies innovation and dedication to improving material performance. His contributions through patents and collaborations continue to influence the industry positively.