Hopewell Junction, NY, United States of America

Mutka G Farooq


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2014

where 'Filed Patents' based on already Granted Patents

1 patent (USPTO):

Title: Mutka G Farooq: Innovator in Bonded Substrate Technology

Introduction

Mutka G Farooq is a notable inventor based in Hopewell Junction, NY (US). She has made significant contributions to the field of materials science, particularly in the area of bonded substrates. Her innovative approach has led to the development of a unique patent that enhances the bonding process between substrates.

Latest Patents

Mutka G Farooq holds a patent for a "Polymeric edge seal for bonded substrates." This invention involves applying a layer of polymer material on the peripheral region of at least one of the two substrates before bonding. The resulting bonded structure includes a first substrate, a second substrate in direct contact with the first substrate, and a ring of polymer material that seals the interface between the two substrates. This innovative design can also accommodate a ring-shaped cavity within the polymeric ring, providing versatility in application.

Career Highlights

Mutka G Farooq is currently employed at International Business Machines Corporation (IBM), where she continues to push the boundaries of technology and innovation. Her work has been instrumental in advancing the capabilities of bonded materials, making her a valuable asset to her team and the industry.

Collaborations

Throughout her career, Mutka has collaborated with esteemed colleagues such as Thomas F Houghton and Nitin H Parbhoo. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Mutka G Farooq is a pioneering inventor whose work in polymeric edge seals for bonded substrates exemplifies her commitment to innovation. Her contributions to IBM and the field of materials science continue to inspire future advancements.

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