The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Jul. 09, 2018
International Business Machines Corporation;
Sampath Purushothaman, Armonk, NY (US);
Roy Rongqing Yu, Armonk, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An article of manufacture is formed by preparing a first silicon-on-insulator (SOI) wafer with first bonding pads at a first top or back-end-of-line (BEOL) surface thereof, preparing a second SOI wafer with second bonding pads at a second BEOL surface thereof, and attaching the first and second SOI wafers by bonding their bonding pads together, thereby producing a sandwiched wafer with first and second bottom or front-end-of-line (FEOL) surfaces facing outward and with first and second BEOL surfaces facing each other near the midline of the sandwiched wafer. The first SOI wafer then is prepared for packaging by first removing the silicon substrate from the first FEOL surface to reveal a buried oxide (BOX) layer, then fabricating interconnects atop the BOX layer and forming input output pads atop the interconnects.