The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Nov. 30, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

James P. Doyle, Armonk, NY (US);

Geraud Dubois, Armonk, NY (US);

Nicholas C. Fuller, Armonk, NY (US);

Teddie P. Magbitang, Armonk, NY (US);

Robert D. Miller, Armonk, NY (US);

Sampath Purushothaman, Armonk, NY (US);

Willi Volksen, Armonk, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76835 (2013.01); H01L 21/31144 (2013.01); H01L 21/76808 (2013.01); H01L 21/76811 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 23/53295 (2013.01);
Abstract

A process comprises insulating a porous low k substrate with an organic polymer coating where the polymer does not penetrate or substantially penetrate the pores of the substrate, e.g., pores having a pore diameter of about one nm to about 5 nm, thereby completely or substantially mitigating the potential for capacitance increase of the substrate. The substrate comprises porous microcircuit substrate materials with surface pores optionally opening into subsurface pores. The organic polymer has a molecular weight greater than about 5,000 to greater than about 10,000 and a glass transition temperature greater than about 200° C. up to about the processing temperature required for forming the imaging layer and antireflective layer in a microcircuit, e.g., greater than about 225° C. The invention includes production of a product by this process and an article of manufacture embodying these features.


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