The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2013
Filed:
Apr. 10, 2012
Kuan-neng Chen, White Plains, NY (US);
Bruce K. Furman, Poughquag, NY (US);
Sampath Purushothaman, Yorktown Heights, NY (US);
David L. Rath, Stormville, NY (US);
Anna W. Topol, Wappingers Falls, NY (US);
Cornelia K. Tsang, Mohegan Lake, NY (US);
Kuan-Neng Chen, White Plains, NY (US);
Bruce K. Furman, Poughquag, NY (US);
Sampath Purushothaman, Yorktown Heights, NY (US);
David L. Rath, Stormville, NY (US);
Anna W. Topol, Wappingers Falls, NY (US);
Cornelia K. Tsang, Mohegan Lake, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Bonding of substrates including metal-dielectric patterns on a surface with the metal raised above the dielectric, as well as related structures, are disclosed. One method includes providing a first substrate having a metal-dielectric pattern on a surface thereof; providing a second substrate having a metal-dielectric pattern on a surface thereof; performing a process resulting in the metal being raised above the dielectric; cleaning the metal; and bonding the first substrate to the second substrate. A related structure is also disclosed. The bonding of raised metal provides a strong bonding medium, and good electrical and thermal connections enabling creation of three dimensional integrated structures with enhanced functionality.