The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2012
Filed:
May. 26, 2010
Stephen Leslie Buchwalter, Hopewell Junction, NY (US);
Bruce K. Furman, Poughquag, NY (US);
Peter A. Gruber, Mohegan Lake, NY (US);
Jae-woong Nah, Yorktown Heights, NY (US);
Da-yuan Shih, Poughkeepsie, NY (US);
Stephen Leslie Buchwalter, Hopewell Junction, NY (US);
Bruce K. Furman, Poughquag, NY (US);
Peter A. Gruber, Mohegan Lake, NY (US);
Jae-Woong Nah, Yorktown Heights, NY (US);
Da-Yuan Shih, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.