The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2011
Filed:
Feb. 17, 2010
Levi A. Campbell, Poughkeepsie, NY (US);
Richard C. Chu, Hopewell Junction, NY (US);
Michael J. Ellsworth, Jr., Lagrangeville, NY (US);
Bruce K. Furman, Saratoga Springs, NY (US);
Madhusudan K. Iyengar, Woodstock, NY (US);
Paul A. Lauro, Brewster, NY (US);
Roger R. Schmidt, Poughkeepsie, NY (US);
Da-yuan Shih, Poughkeepsie, NY (US);
Robert E. Simons, Poughkeepsie, NY (US);
Levi A. Campbell, Poughkeepsie, NY (US);
Richard C. Chu, Hopewell Junction, NY (US);
Michael J. Ellsworth, Jr., Lagrangeville, NY (US);
Bruce K. Furman, Saratoga Springs, NY (US);
Madhusudan K. Iyengar, Woodstock, NY (US);
Paul A. Lauro, Brewster, NY (US);
Roger R. Schmidt, Poughkeepsie, NY (US);
Da-Yuan Shih, Poughkeepsie, NY (US);
Robert E. Simons, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.