The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2003

Filed:

Aug. 09, 2002
Applicant:
Inventors:

David V. Caletka, Apalachin, NY (US);

Krishna Darbha, Kirkland, WA (US);

Donald W. Henderson, Ithaca, NY (US);

Lawrence P. Lehman, Endicott, NY (US);

George H. Thiel, Endicott, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05L 2/328 ; H05K 5/06 ;
U.S. Cl.
CPC ...
H05L 2/328 ; H05K 5/06 ;
Abstract

An electronic package is provided including a substrate, a device mounted on the substrate, and a solder member electrically coupling the device to the substrate. The package includes a dielectric material positioned substantially around the solder member which forms a physical connection between the substrate and the device. The volume of the solder member contracts during melting thereof to prevent failure of the physical connection and/or the electrical coupling between the substrate and the device.


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