Krishna Darbha

Title: Innovations by Krishna Darbha

Introduction

Krishna Darbha is a notable inventor based in Johnson City, NY (US). He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work primarily focuses on methods to enhance the integrity of electronic devices during manufacturing processes.

Latest Patents

One of Krishna's latest patents is titled "Method to accommodate increase in volume expansion during solder reflow." This invention addresses the challenges faced by low melt C4 solder balls, which undergo volume expansion during the reflow process. When these solder balls are encapsulated, the resulting expansion pressure can compromise the integrity of the device. To mitigate this issue, Krishna's invention proposes a volume expansion region in the semiconductor chip substrate beneath each solder ball. This region accommodates the volume expansion, utilizing air-cushioned diaphragms, deformable materials, and non-wettable surfaces to allow the solder to return to its original site during cooling. Additionally, a porous medium with sufficient voids to accommodate expansion may also be employed.

Career Highlights

Krishna Darbha is currently associated with International Business Machines Corporation (IBM), where he continues to innovate and develop new technologies. His expertise in semiconductor manufacturing processes has positioned him as a valuable asset in the industry.

Collaborations

Throughout his career, Krishna has collaborated with esteemed colleagues, including David V Caletka and Sanjeev Balwant Sathe. These partnerships have further enriched his work and contributed to the advancement of technology in his field.

Conclusion

In summary, Krishna Darbha is a prominent inventor whose work in semiconductor technology has led to significant advancements in manufacturing processes. His innovative patents reflect his commitment to enhancing device integrity and performance.