Apalachin, NY, United States of America

David V Caletka


Average Co-Inventor Count = 2.8

ph-index = 14

Forward Citations = 656(Granted Patents)


Company Filing History:


Years Active: 1998-2011

where 'Filed Patents' based on already Granted Patents

34 patents (USPTO):

Title: David V. Caletka: A Pioneer in High-Speed Interposer Technology

Introduction

David V. Caletka, residing in Apalachin, NY, has established himself as a remarkable inventor with a significant portfolio of 34 patents. His innovations predominantly focus on enhancing semiconductor technologies, particularly in interposer design and solder reflow methods.

Latest Patents

Among Caletka's latest contributions to the field are two notable patents. The first is a "High speed interposer," which incorporates a substrate consisting of alternating dielectric and conductive layers. This innovative design includes openings extending through the substrate, supporting conductive members positioned for effective high-frequency signal transmission. To mitigate interference, a plurality of shielding members is strategically placed around the conductive pathways.

The second patent is centered on a "Method to accommodate increase in volume expansion during solder reflow." This addresses the issue of solder balls, specifically, low melt C4 solder balls, experiencing volume expansion that can jeopardize device integrity during reflow. Caletka's solution involves designing a volume expansion region in the semiconductor chip substrate beneath each solder ball, using materials that allow for deformation and returning solder to its original site during cooling.

Career Highlights

Caletka has had a distinguished career working closely with leading technology firms, notably IBM and Endicott Interconnect Technologies, Inc. At IBM, he contributed to critical advancements in technology, while his tenure at Endicott Interconnect allowed him to further explore and implement novel interposer and solder technologies.

Collaborations

Throughout his journey, Caletka has collaborated with other innovative minds, including coworkers Eric A. Johnson and Krishna Darbha. These partnerships have enabled the exchange of ideas and fostered the development of advanced technologies in their respective fields.

Conclusion

David V. Caletka is a renowned inventor whose significant contributions to high-speed interposer technology and solder reflow methodology have made lasting impacts in the semiconductor industry. His dedication to innovation is reflected in his extensive patent portfolio and collaborative efforts with leading technology corporations.

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