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For the Inventor, By the Inventor

Croton-on-Hudson, NY, United States of America

Carlos Juan Sambucetti

This inventor holds 63 USPTO granted patents, plus 1 CIPO patent, primarily in Semiconductor Packaging (CPC class 4273). Top assignee: International Business Machines Corporation. Active years: 1977-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Carlos Juan Sambucetti. Retrieved from https://idiyas.com/inventor/carlos-juan-sambucetti

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 63

% Patents Active = 95.2


Average Co-Inventor Count = 4.6

ph-index = 21

Forward Citations = 2,457(Granted Patents)

Forward Citations (Not Self Cited) = 2,442(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Mohegan Lake, NY (US) (1977)
  • Groton-on-Hudson, NY (US) (1978)
  • Croton Hudson, NY (US) (2002 - 2003)
  • Vallejo, CA (US) (2007)
  • Croton-on-Hudson, NY (US) (1980 - 2011)

Company Filing History:

goldMedal63 out of 166,409 
 
International Business Machines Corporation
 patents

Years Active: 1977-2011

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Areas of Expertise:
Interconnect Structures
Solder Microjoining
Corrosion Prevention
Electromigration
Chip Attachment
Conductive Composites
Fine Line Substrates
Damascene Interconnects
Metallization Techniques
Electrical Connections
Polymer Adhesion
Testing Methods
63 patents (USPTO):Explore Patents
1. 7880305 - Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer (2011-02-01),
2. 7825516 - Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures (2010-11-02),
3. 7468320 - Reduced electromigration and stressed induced migration of copper wires by surface coating (2008-12-23),
4. 7273803 - Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure (2007-09-25),
5. 7081680 - Self-aligned corrosion stop for copper C4 and wirebond (2006-07-25),
6. 7033648 - Means of seeding and metallizing polyimide (2006-04-25),
7. 6819000 - High density area array solder microjoining interconnect structure and fabrication method (2004-11-16),
8. 6779711 - Self-aligned corrosion stop for copper C4 and wirebond (2004-08-24),
9. 6747472 - Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same (2004-06-08),
10. 6732908 - High density raised stud microjoining system and methods of fabricating the same (2004-05-11),
11. 6661098 - High density area array solder microjoining interconnect structure and fabrication method (2003-12-09),
12. 6656750 - Method for testing chips on flat solder bumps (2003-12-02),
13. 6646345 - Method for forming Co-W-P-Au films (2003-11-11),
14. 6573606 - Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect (2003-06-03),
15. 6566612 - Method for direct chip attach by solder bumps and an underfill layer (2003-05-20),

Title: **Innovative Contributions of Carlos Juan Sambucetti**

Introduction

Carlos Juan Sambucetti is a prominent inventor based in Croton-on-Hudson, NY. With an impressive portfolio of 63 patents, he has made significant contributions to the field of semiconductor technology and packaging solutions. His work reflects a deep commitment to advancing technical capabilities and solving complex engineering challenges.

Latest Patents

Among his latest innovations, Sambucetti developed a technology for the fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer. This invention introduces a groundbreaking approach to creating a packaging intermediate product that serves as an interface substrate positioned between different circuitry types, especially suited for dimensions approaching the sub-100 micrometer range. The dielectric wafer structure he designed enhances performance through various key processes, including aligning blind via openings and ensuring a smooth planarized surface.

Additionally, he has worked on the formation of aligned capped metal lines and interconnections in multilevel semiconductor structures. This patent addresses the challenges of electromigration and diffusion, providing a novel processing procedure that optimizes conductor materials like copper within a low K effective dielectric environment. The innovations here offer robust solutions to improve the reliability and efficiency of integrated circuits.

Career Highlights

Carlos Juan Sambucetti's career is predominantly linked with the International Business Machines Corporation (IBM), a leader in technological innovation. His extensive work there has positioned him as a critical contributor to advancements in semiconductor technologies. His expertise has not only led to numerous patents but also to innovative methodologies that are widely recognized in the industry.

Collaborations

Throughout his career, Sambucetti has collaborated with several notable peers, including Voya Rista Markovich and Judith Marie Rubino. These collaborations have nurtured an environment of innovation at IBM, highlighting the importance of teamwork in achieving groundbreaking advancements in technology.

Conclusion

As an inventor, Carlos Juan Sambucetti has demonstrated remarkable foresight and skill in the realm of technology and engineering. His 63 patents are a testament to his dedication to innovation, paving the way for future advancements in semiconductor and packaging technologies. His work continues to influence the industry, inspiring the next generation of inventors and engineers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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