The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2004
Filed:
Oct. 23, 2003
John Harold Magerlein, Yorktown Heights, NY (US);
Kevin Shawn Petrarca, Newburgh, NY (US);
Sampath Purushothaman, Yorktown Heights, NY (US);
Carlos Juan Sambucetti, Croton-on-Hudson, NY (US);
Richard Paul Volant, New Fairfield, CT (US);
George Frederick Walker, New York, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A system for interconnecting a set of device chips by means of an array of microjoints disposed on an interconnect carrier is taught. The carrier is provided with a dense array of microjoint receptacles with an adhesion layer, barrier layer and a noble metal layer; the device wafers are fabricated with an array of microjoining pads including an adhesion layer, barrier layer and a fusible solder layer with pads being located at matching locations in reference to the barrier receptacles; the device chips are joined to the carrier through the microjoint arrays resulting in interconnections capable of very high input/output density and inter-chip wiring density.