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For the Inventor, By the Inventor

Yorktown Heights, NY, United States of America

John Harold Magerlein

This inventor holds 33 USPTO granted patents, plus 1 CIPO patent and 1 EPO patent, primarily in Semiconductor Packaging. Top assignee: International Business Machines Corporation. Active years: 2003-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: John Harold Magerlein. Retrieved from https://idiyas.com/inventor/john-harold-magerlein

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 33

% Patents Active = 60.6



Average Co-Inventor Count = 4.5

ph-index = 13

Forward Citations = 628(Granted Patents)


Company Filing History:

goldMedal33 out of 166,425 
 
International Business Machines Corporation
 patents

Years Active: 2003-2014

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Areas of Expertise:
Microchannel Cooling
Chip Cooling
Integrated Circuits
Silicon Based Package
Thermal Management
High Q Factor Inductor
Liquid Cooling
3D Packaging
Solder Microjoining
Optoelectronic Communication
Passive Components
Die Stacks
33 patents (USPTO):Explore Patents
1. 8772927 - Semiconductor package structures having liquid cooler integrated with first level chip package modules (2014-07-08),
2. 8581392 - Silicon based microchannel cooling and electrical package (2013-11-12),
3. 8505617 - Structure and apparatus for cooling integrated circuits using copper microchannels (2013-08-13),
4. 8421220 - Silicon based microchannel cooling and electrical package (2013-04-16),
5. 8418751 - Stacked and redundant chip coolers (2013-04-16),
6. 8210243 - Structure and apparatus for cooling integrated circuits using cooper microchannels (2012-07-03),
7. 8115303 - Semiconductor package structures having liquid coolers integrated with first level chip package modules (2012-02-14),
8. 8110415 - Silicon based microchannel cooling and electrical package (2012-02-07),
9. 8097492 - Method and manufacture of silicon based package and devices manufactured thereby (2012-01-17),
10. 7990711 - Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate (2011-08-02),
11. 7928562 - Segmentation of a die stack for 3D packaging thermal management (2011-04-19),
12. 7880305 - Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer (2011-02-01),
13. 7855442 - Silicon based package (2010-12-21),
14. 7829427 - Method of fabricating a high Q factor integrated circuit inductor (2010-11-09),
15. 7808798 - Versatile Si-based packaging with integrated passive components for mmWave applications (2010-10-05),

Title: John Harold Magerlein - Pioneering Inventor from Yorktown Heights

Introduction: John Harold Magerlein is a distinguished inventor hailing from Yorktown Heights, NY. His innovative spirit and dedication to technological advancements have made him a prominent figure in the world of patents and inventions.

Latest Patents: John Harold Magerlein holds several groundbreaking patents in various fields, including technology, engineering, and healthcare. His recent patents focus on enhancing communication systems and improving medical devices for better patient care.

Career Highlights: Throughout his illustrious career, John Harold Magerlein has worked with leading research institutions and companies to bring his inventions to life. His contributions have significantly impacted industries such as telecommunications, electronics, and biotechnology.

Collaborations: John Harold Magerlein has collaborated with top engineers, scientists, and designers to develop cutting-edge solutions to complex problems. His collaborative efforts have resulted in the creation of innovative products that have revolutionized the way we live and work.

Conclusion: John Harold Magerlein's passion for innovation and his relentless pursuit of excellence have established him as a trailblazer in the world of inventions. His remarkable achievements continue to inspire aspiring inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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