The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2011
Filed:
Jul. 22, 2008
Amilcar R. Arvelo, Poughkeepsie, NY (US);
Evan G. Colgan, Chestnut Ridge, NY (US);
John H. Magerlein, Yorktown Heights, NY (US);
Kenneth C. Marston, Poughquag, NY (US);
Kathryn C. Rivera, Hopewell Junction, NY (US);
Kamal K. Sikka, Poughkeepsie, NY (US);
Jamil A. Wakil, Austin, TX (US);
Xiaojin Wei, Fishkill, NY (US);
Jeffrey A. Zitz, Poughkeepsie, NY (US);
Amilcar R. Arvelo, Poughkeepsie, NY (US);
Evan G. Colgan, Chestnut Ridge, NY (US);
John H. Magerlein, Yorktown Heights, NY (US);
Kenneth C. Marston, Poughquag, NY (US);
Kathryn C. Rivera, Hopewell Junction, NY (US);
Kamal K. Sikka, Poughkeepsie, NY (US);
Jamil A. Wakil, Austin, TX (US);
Xiaojin Wei, Fishkill, NY (US);
Jeffrey A. Zitz, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.