Jamil A Wakil

USPTO Granted Patents = 14 (Patent Applications = 1)

Average Co-Inventor Count = 4.5

ph-index = 7

Forward Citations = 181(Granted Patents)

Location History:

Binghamton, NY (US) (2003 - 2004)
Wappingers Falls, NY (US) (2004 - 2011)
Buchanan Dam, TX (US) (2010 - 2011)
Austin, TX (US) (2011 - 2018)

Company Filing History:

13 out of 164,108

International Business Machines Corporation

patents

1 out of 4,126

Lenovo (singapore) Pte. Ltd.

patents

Years Active: 2003-2018

where 'Filed Patents' based on already Granted Patents

14 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 9943936 - Overmolded dual in-line memory module cooling structure (2018-04-17),

2. 8900503 - Method of forming an overmolded dual in-line memory module cooling structure (2014-12-02),

3. 8299608 - Enhanced thermal management of 3-D stacked die packaging (2012-10-30),

4. 8037594 - Method of forming a flip-chip package (2011-10-18),

5. 7982475 - Structure and method for reliability evaluation of FCPBGA substrates for high power semiconductor packaging applications (2011-07-19),

6. 7928562 - Segmentation of a die stack for 3D packaging thermal management (2011-04-19),

7. 7698114 - Techniques for distributing power in electronic circuits and computer systems (2010-04-13),

8. 7489512 - Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages (2009-02-10),

9. 7319591 - Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages (2008-01-15),

10. 7167806 - Method and system for measuring temperature and power distribution of a device (2007-01-23),

11. 6829144 - Flip chip package with heat spreader allowing multiple heat sink attachment (2004-12-07),

12. 6793123 - Packaging for multi-processor shared-memory system (2004-09-21),

13. 6622786 - Heat sink structure with pyramidic and base-plate cut-outs (2003-09-23),

14. 6541847 - Packaging for multi-processor shared-memory system (2003-04-01),

Certainly! Here is the article about inventor Jamil A. Wakil:

Title: Innovator Spotlight: Jamil A. Wakil

Introduction:

Jamil A. Wakil, a renowned inventor based in Austin, Texas (US), has made significant contributions to the field of technology with his innovative patents and groundbreaking ideas. With a total of 14 patents to his name, Wakil continues to push the boundaries of what is possible in the realm of dual in-line memory module (DIMM) cooling structures.

Latest Patents:

Wakil's latest patents revolve around the development of an overmolded dual in-line memory module cooling structure. These patents introduce methods, apparatuses, and computer program products for forming advanced cooling systems for DIMMs. One notable feature is the inclusion of a tagging module that can identify contextual information related to photographs, suggesting friends for tagging based on the circumstances surrounding the image capture.

Career Highlights:

Throughout his career, Jamil A. Wakil has made significant contributions to industry giants such as IBM and Lenovo Enterprise Solutions (Singapore) Pte. Ltd. His expertise and dedication to innovation have been instrumental in shaping the future of technology, particularly in the realm of memory module cooling solutions.

Collaborations:

Wakil has had the privilege of collaborating with esteemed professionals in the field, including Kamal Kumar Sikka and Randall Joseph Stutzman. Together, they have worked on projects that have revolutionized the way cooling structures are designed and implemented in memory modules.

Conclusion:

In conclusion, Jamil A. Wakil stands as a pioneering figure in the world of technology, with his inventive patents and unwavering commitment to pushing the boundaries of innovation. His work not only showcases his technical prowess but also underscores his passion for creating solutions that drive progress in the industry.

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