The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2011
Filed:
May. 07, 2008
Jeffrey T. Coffin, Pleasant Valley, NY (US);
Michael A. Gaynes, Vestal, NY (US);
David L. Questad, Hopewell Junction, NY (US);
Kamal K. Sikka, Poughkeepsie, NY (US);
Hilton T. Toy, Hopewell Junction, NY (US);
Jamil A. Wakil, Wappingers Falls, NY (US);
Jeffrey T. Coffin, Pleasant Valley, NY (US);
Michael A. Gaynes, Vestal, NY (US);
David L. Questad, Hopewell Junction, NY (US);
Kamal K. Sikka, Poughkeepsie, NY (US);
Hilton T. Toy, Hopewell Junction, NY (US);
Jamil A. Wakil, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.