The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2012
Filed:
Jul. 08, 2010
Gerald K. Bartley, Rochester, MN (US);
David R. Motschman, Rochester, MN (US);
Kamal K. Sikka, Hopewell Junction, NY (US);
Jamil A. Wakil, Austin, TX (US);
Xiaojin Wei, Hopewell Junction, NY (US);
Jiantao Zheng, Hopewell Junction, NY (US);
Gerald K. Bartley, Rochester, MN (US);
David R. Motschman, Rochester, MN (US);
Kamal K. Sikka, Hopewell Junction, NY (US);
Jamil A. Wakil, Austin, TX (US);
Xiaojin Wei, Hopewell Junction, NY (US);
Jiantao Zheng, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate.