The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2007

Filed:

Aug. 17, 2004
Applicants:

Hendrik F. Hamann, Yorktown Heights, NY (US);

James A. Lacey, Mahopac, NY (US);

Martin P. O'boyle, Cortlandt Manor, NY (US);

Robert J. Von Gutfeld, New York, NY (US);

Jamil A. Wakil, Wappingers Falls, NY (US);

Alan J. Weger, Mohegan Lake, NY (US);

Inventors:

Hendrik F. Hamann, Yorktown Heights, NY (US);

James A. Lacey, Mahopac, NY (US);

Martin P. O'Boyle, Cortlandt Manor, NY (US);

Robert J. von Gutfeld, New York, NY (US);

Jamil A. Wakil, Wappingers Falls, NY (US);

Alan J. Weger, Mohegan Lake, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A present invention provides real-time temperature and power mapping of fully operating electronic devices. The method utilizes infrared (IR) temperature imaging, while an IR-transparent coolant flows through a specially designed cell directly over the electronic device. In order to determine the chip power distributions the individual temperature fields for each heat source of a given power and size on the chip (as realized by a scanning focused laser beam) are measured under the same cooling conditions. Then the measured chip temperature distribution is represented as a superposition of the temperature fields of these individual heat sources and the corresponding power distribution is calculated with a set of linear equations.


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