The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2014
Filed:
Nov. 07, 2011
Raschid Jose Bezama, Hopewell Junction, NY (US);
Evan George Colgan, Yorktown Heights, NY (US);
Michael Gaynes, Yorktown Heights, NY (US);
John Harold Magerlein, Yorktown Heights, NY (US);
Kenneth C. Marston, Hopewell Junction, NY (US);
Xiaojin Wei, Hopewell Junction, NY (US);
Raschid Jose Bezama, Hopewell Junction, NY (US);
Evan George Colgan, Yorktown Heights, NY (US);
Michael Gaynes, Yorktown Heights, NY (US);
John Harold Magerlein, Yorktown Heights, NY (US);
Kenneth C. Marston, Hopewell Junction, NY (US);
Xiaojin Wei, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.