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For the Inventor, By the Inventor

Mahopac, NY, United States of America

Raschid Jose Bezama

USPTO Granted Patents = 74 


Average Co-Inventor Count = 3.4

ph-index = 15

Forward Citations = 843(Granted Patents)

DiyaCoin DiyaCoin = 0.57 


Inventors with similar research interests:


Location History:

  • Yorktown Heights, NY (US) (2013)
  • Putnam Valley, NY (US) (2003 - 2014)
  • Hopewell Junction, NY (US) (2014)
  • Mahopac, NY (US) (1987 - 2019)

Company Filing History:

goldMedal74 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1987-2019

where 'Filed Patents' based on already Granted Patents

74 patents (USPTO):
1. 10242931 - Liquid cooled compliant heat sink and related method (2019-03-26),
2. 10177075 - Liquid cooled compliant heat sink and related method (2019-01-08),
3. 9574283 - Rinsing and drying for electrochemical processing (2017-02-21),
4. 9222194 - Rinsing and drying for electrochemical processing (2015-12-29),
5. 9035459 - Structures for improving current carrying capability of interconnects and methods of fabricating the same (2015-05-19),
6. 9018760 - Solder interconnect with non-wettable sidewall pillars and methods of manufacture (2015-04-28),
7. 8926820 - Working electrode design for electrochemical processing of electronic components (2015-01-06),
8. 8803317 - Structures for improving current carrying capability of interconnects and methods of fabricating the same (2014-08-12),
9. 8784618 - Working electrode design for electrochemical processing of electronic components (2014-07-22),
10. 8772927 - Semiconductor package structures having liquid cooler integrated with first level chip package modules (2014-07-08),
11. 8674506 - Structures and methods to reduce maximum current density in a solder ball (2014-03-18),
12. 8637392 - Solder interconnect with non-wettable sidewall pillars and methods of manufacture (2014-01-28),
13. 8623194 - Multi-anode system for uniform plating of alloys (2014-01-07),
14. 8551303 - Multi-anode system for uniform plating of alloys (2013-10-08),
15. 8505617 - Structure and apparatus for cooling integrated circuits using copper microchannels (2013-08-13),

Title: Innovator Spotlight: Raschid Jose Bezama - Pioneering Inventor in Cooling Technology

Introduction:

Raschid Jose Bezama is a prolific inventor based in Mahopac, NY, with an impressive portfolio of 74 patents to his name. His groundbreaking work in the field of cooling technology has transformed the way integrated circuits are kept cool, showcasing his ingenuity and dedication to innovation.

Latest Patents:

Among his latest patents is the 'Liquid Cooled Compliant Heat Sink and Related Method', a revolutionary heat sink designed to efficiently cool integrated circuit (IC) chips. This innovation features a unique liquid-filled cooling system and a compliant foil that conforms to the surface of the IC chip, enhancing thermal coupling and reducing air gaps for optimal cooling performance.

Career Highlights:

Raschid Jose Bezama is a valued member of the renowned International Business Machines Corporation (IBM), where his inventive spirit and technical expertise have made a significant impact. Through his relentless pursuit of excellence, he has contributed immensely to IBM's reputation as a leader in technological innovation.

Collaborations:

Collaborating with esteemed colleagues such as Govindarajan Natarajan and Charles Leon Arvin, Raschid Jose Bezama has leveraged collective knowledge and expertise to push the boundaries of cooling technology further. His ability to work effectively in a team highlights his collaborative nature and his commitment to achieving shared goals.

Conclusion:

In conclusion, Raschid Jose Bezama stands out as a trailblazer in the realm of cooling technology, with a remarkable track record of patents that have revolutionized the industry. His innovative solutions and collaborative approach exemplify the qualities of a true visionary in the world of inventions.

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