The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2013
Filed:
Feb. 28, 2012
Charles L. Arvin, Poughkeepsie, NY (US);
Raschid J. Bezama, Putnam Valley, NY (US);
Harry D. Cox, Rifton, NY (US);
Krystyna W. Semkow, Poughquag, NY (US);
Charles L. Arvin, Poughkeepsie, NY (US);
Raschid J. Bezama, Putnam Valley, NY (US);
Harry D. Cox, Rifton, NY (US);
Krystyna W. Semkow, Poughquag, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.