International Business Machines Corporation

Raschid Jose Bezama

Govindarajan Natarajan

Charles Leon Arvin

John Ulrich Knickerbocker

Evan G Colgan

Krystyna Waleria Semkow

John Harold Magerlein

Robert William Pasco

Timothy Harrison Daubenspeck

Timothy Dooling Sullivan

David Clifford Long

Harry David Cox

Roger R Schmidt

Hariklia Deligianni

Dominic Joseph Schepis

Dario Leonardo Goldfarb

Jon Alfred Casey

Krishna Seshan

Xiaojin Wei

Donald Rene Wall

Dmitriy Shneyder

Laertis Economikos

Lester W Herron

Keith C O'Neil

Renee L Weisman

Jeffrey P Gambino

Madhusudan K Iyengar

Michael A Gaynes

Wolfgang Sauter

Christopher David Muzzy

Thomas Weiss

Hilton T Toy

Kamal Kumar Sikka

Kafai Lai

David L Questad

Steven Lorenz Wright

Mark J LaPlante

Thomas Anthony Wassick

Shaji Farooq

Brian Richard Sundlof

James N Humenik

Ian D Melville

Robert Anthony Rita

Rao Venkateswara Vallabhaneni

Kenneth Charles Marston

Ekta Misra

Robin A Susko

Glen Nelson Biggs

Tracy A Tong

Mario E Ecker

Jason Scott Miller

George John Scott

Gary Lafontant

Vivek M Sura

David H Gabriels

Yee-Ming Ting

Giai V Yen

Joseph Gang Zhou

Kafal Lai

Irene S Frantz

John Thomson

Sharon L Tracy

Robert M Troncillito

Bruno Michel

Xiao Hu Liu

Benjamin V Fasano

Charles Hampton Perry

David Lewis Gardell

Sarah Huffsmith Knickerbocker

Lewis Sigmund Goldmann

Raed A Sherif

Dinesh Gupta

Daniel George Berger

Glenn A Pomerantz

Gregory M Johnson

John Blake Pavelka

Umar M Ahmad

Randall Jason Werner

Michael A Cohn

Kenneth A Bird

John F Harmuth

Alan Piciacchio

Benjamin Paul Tongue

William W Harkins

Nike Oluwakemi Medahunsi

Nancy A Wier-Cavalieri

Christopher E Pepe

Sara H Knickerbocker

Katharine G Frase

John A Rudy

Ronald M Rothkranz

Amy C Flack

Arnold W Terpening

Katherine G Frase

A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.

Liquid cooled compliant heat sink and related method

An electroplating/etch apparatus including a fluid jet and a dryer present over the tank containing the electrolyte for the electroplating/etch process. The fluid jet and the dryer remove excess liquids, such as electrolyte, from the component being plated or etched, e.g., working electrode. The working electrode is present on a holder that traverses from a first position within the tank during a plating or etch operation to a second position that is outside the containing the plating electrolyte. The fluid jet rinses the working electrode when the holder is in the second position, and the forced air dryer blows any remaining fluid from the fluid jet and the electrolyte from the working electrode into the tank.

Rinsing and drying for electrochemical processing

Interconnect structures and methods of fabricating the same are provided. The interconnect structures provide highly reliable copper interconnect structures for improving current carrying capabilities (e.g., current spreading). The structure includes an under bump metallurgy formed in a trench. The under bump metallurgy includes at least: an adhesion layer; a plated barrier layer; and a plated conductive metal layer provided between the adhesion layer and the plated barrier layer. The structure further includes a solder bump formed on the under bump metallurgy.

Structures for improving current carrying capability of interconnects and methods of fabricating the same

A solder interconnect structure is provided with non-wettable sidewalls and methods of manufacturing the same. The method includes forming a nickel or nickel alloy pillar on an underlying surface. The method further includes modifying the sidewall of the nickel or nickel alloy pillar to prevent solder wetting on the sidewall.

Solder interconnect with non-wettable sidewall pillars and methods of manufacture

An electroplating apparatus including a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.

Working electrode design for electrochemical processing of electronic components

An electroplating apparatus is provided that includes a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.

Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.

Semiconductor package structures having liquid cooler integrated with first level chip package modules

Structures and methods to reduce maximum current density in a solder ball are disclosed. A method includes forming a contact pad in a last wiring level and forming a plurality of wires of the contact pad extending from side edges of the contact pad to respective ones of a plurality of vias. Each one of the plurality of wires has substantially the same electrical resistance.

Structures and methods to reduce maximum current density in a solder ball

Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.

Multi-anode system for uniform plating of alloys

A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.

Structure and apparatus for cooling integrated circuits using copper microchannels

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Mahopac, NY, United States of America

Raschid Jose Bezama