The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2014
Filed:
Aug. 19, 2010
Charles L. Arvin, Poughkeepsie, NY (US);
Raschid J. Bezama, Mahopac, NY (US);
Glen N. Biggs, Wappinger Falls, NY (US);
Hariklia Deligianni, Tenafly, NJ (US);
Tracy A. Tong, Wallkill, NY (US);
Charles L. Arvin, Poughkeepsie, NY (US);
Raschid J. Bezama, Mahopac, NY (US);
Glen N. Biggs, Wappinger Falls, NY (US);
Hariklia Deligianni, Tenafly, NJ (US);
Tracy A. Tong, Wallkill, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electroplating apparatus is provided that includes a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.