The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Jun. 20, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Raschid J. Bezama, Mahopac, NY (US);

David C. Long, Wappingers Falls, NY (US);

Govindarajan Natarajan, Poughkeepsie, NY (US);

Thomas Weiss, Poughkeepsie, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); H01L 23/473 (2006.01); F28D 15/00 (2006.01); H01L 23/373 (2006.01); F28F 13/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4735 (2013.01); F28D 15/00 (2013.01); H01L 23/3733 (2013.01); H01L 23/473 (2013.01); F28F 13/00 (2013.01); F28F 2013/006 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.


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