The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2014
Filed:
Feb. 05, 2010
Charles L. Arvin, Hopewell Junction, NY (US);
Raschid J. Bezama, Hopewell Junction, NY (US);
Timothy H. Daubenspeck, Essex Junction, VT (US);
Jeffrey P. Gambino, Essex Junction, VT (US);
Christopher D. Muzzy, Essex Junction, VT (US);
David L. Questad, Hopewell Junction, NY (US);
Wolfgang Sauter, Essex Junction, VT (US);
Timothy D. Sullivan, Essex Junction, VT (US);
Brian R. Sundlof, Hopewell Junction, NY (US);
Charles L. Arvin, Hopewell Junction, NY (US);
Raschid J. Bezama, Hopewell Junction, NY (US);
Timothy H. Daubenspeck, Essex Junction, VT (US);
Jeffrey P. Gambino, Essex Junction, VT (US);
Christopher D. Muzzy, Essex Junction, VT (US);
David L. Questad, Hopewell Junction, NY (US);
Wolfgang Sauter, Essex Junction, VT (US);
Timothy D. Sullivan, Essex Junction, VT (US);
Brian R. Sundlof, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A solder interconnect structure is provided with non-wettable sidewalls and methods of manufacturing the same. The method includes forming a nickel or nickel alloy pillar on an underlying surface. The method further includes modifying the sidewall of the nickel or nickel alloy pillar to prevent solder wetting on the sidewall.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile