Chappaqua, NY, United States of America

Sung-Kwon Kang


Average Co-Inventor Count = 3.2

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2007-2014

where 'Filed Patents' based on already Granted Patents

2 patents (USPTO):

Title: Innovator Sung-Kwon Kang: Contributing to Thermal Management Solutions

Introduction

Sung-Kwon Kang is an accomplished inventor based in Chappaqua, NY, recognized for his innovative contributions in the field of thermal management. With a total of two patents to his name, he plays a vital role in advancing technologies that enhance heat conduction in electronic devices. His work not only benefits the semiconductor industry but also paves the way for more efficient thermal interface materials.

Latest Patents

Kang's latest patents showcase his expertise in thermal interface technology. One notable patent is for a "Multipath soldered thermal interface between a chip and its heat sink." This invention involves a Thermal Interface Material (TIM) that comprises solderable heat-conducting particles embedded in a bondable resin matrix. The unique design allows for improved heat conductivity, enabling better performance of electronic devices by securely bonding these particles through a heating process. This TIM is particularly crucial in situations where electronic devices, like semiconductor components, are closely integrated with heat sinks.

Another significant patent of Kang's is titled "Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure." This involves a sophisticated layering system that enhances the reliability and efficiency of interconnection structures in electronic devices. It includes multiple layers, such as a barrier layer and adhesion layer, strategically designed to optimize solderability and mitigate diffusion, ensuring robust electronic connections.

Career Highlights

Sung-Kwon Kang is proudly associated with International Business Machines Corporation (IBM), a leading global technology company. His innovative solutions have contributed significantly to the company's developments in electronic component manufacturing. His technical acumen and commitment to excellence have made him a valuable asset in the advancing fields of electronics and thermal management.

Collaborations

In his journey toward innovation, Kang has had the opportunity to collaborate with esteemed colleagues, including Yu-Ting Cheng and Stefanie Ruth Chiras. These collaborations have fostered an environment of creativity and shared knowledge, driving the development of successful solutions in the realm of thermal management technologies.

Conclusion

Sung-Kwon Kang's inventive endeavors in thermal management illustrate the critical role inventors play in enhancing modern technology. His patents not only address significant challenges in heat conduction but also contribute to the evolution of electronic devices. With ongoing collaborations and an unwavering commitment to innovation, Kang continues to influence the landscape of thermal interface materials, paving the way for future advancements in the industry.

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