International Business Machines Corporation

Sung-Kwon Kang

Da-Yuan Shih

Carlos Juan Sambucetti

Donald W Henderson

Yu-Ting Cheng

Henry Atkinson Nye, Iii

Stefanie Ruth Chiras

Stephen James Kilpatrick

George Liang-Tai Chiu

A Thermal Interface Material ('TIM') composition of matter with improved heat conductivity comprises solderable heat-conducting particles in a bondable resin matrix and at least some of the solderable heat-conducting particles comprise a solder surface. Positioning the TIM between a first surface having a solder adhesion layer and a second surface, and then heating it results in soldering some of the solderable heat-conducting particles to one another; and some to the solder-adhesion layer on the first surface as well as adhesively bonding the resin matrix to the first surface and the second surface. The first surface can comprise an electronic device, e.g., a semiconductor device and the second surface a heat sink, such as a solderable heat sink. A product comprises an article of manufacture made by the process.

Multipath soldered thermal interface between a chip and its heat sink

A ball-limiting metallurgy includes a substrate, a barrier layer formed over the substrate, an adhesion layer formed over the barrier layer, a first solderable layer formed over the adhesion layer, a diffusion barrier layer formed over the adhesion layer, and a second solderable layer formed over the diffusion barrier layer.

Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure

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Chappaqua, NY, United States of America

Sung-Kwon Kang