The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2008
Filed:
Mar. 31, 2004
Keith E. Fogel, Hopewell Junction, NY (US);
Balaram Ghosal, Fishkill, NY (US);
Sung K. Kang, Chappaqua, NY (US);
Stephen Kilpatrick, Olney, MD (US);
Paul A. Lauro, Brewster, NY (US);
Henry A. Nye, Iii, Brookfield, CT (US);
Da-yuan Shih, Poughkeepsie, NY (US);
Donna S. Zupanski-nielsen, Yorktown Heights, NY (US);
Keith E. Fogel, Hopewell Junction, NY (US);
Balaram Ghosal, Fishkill, NY (US);
Sung K. Kang, Chappaqua, NY (US);
Stephen Kilpatrick, Olney, MD (US);
Paul A. Lauro, Brewster, NY (US);
Henry A. Nye, III, Brookfield, CT (US);
Da-Yuan Shih, Poughkeepsie, NY (US);
Donna S. Zupanski-Nielsen, Yorktown Heights, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.