The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2002
Filed:
Feb. 29, 2000
Charles R. Davis, Fishkill, NY (US);
Daniel Charles Edelstein, New Rochelle, NY (US);
John C. Hay, Knoxville, TN (US);
Jeffrey C. Hedrick, Montvale, NJ (US);
Christopher Jahnes, Upper Saddle River, NJ (US);
Vincent McGahay, Poughkeepsie, NY (US);
Henry A. Nye, III, Brookfield, CT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A multi-level, coplanar copper damascene interconnect structure on an integrated circuit chip includes a first planar interconnect layer on an integrated circuit substrate and having plural line conductors separated by a dielectric material having a relatively low dielectric constant and a relatively low elastic modulus. A second planar interconnect layer on the first planar interconnect layer comprises a dielectric film having an elastic modulus higher than in the first planar interconnect layer and conductive vias therethrough. The vias are selectively in contact with the line conductors. A third planar interconnect layer on the second planar interconnect layer has plural line conductors separated by the dielectric material and selectively in contact with the vias.