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For the Inventor, By the Inventor

Fishkill, NY, United States of America

Charles Robert Davis

USPTO Granted Patents = 24 

Average Co-Inventor Count = 3.9

ph-index = 11

Forward Citations = 393(Granted Patents)


Location History:

  • Erie, PA (US) (1988)
  • Johnson City, NY (US) (1993)
  • Endicott, NY (US) (1993 - 1998)
  • Wappingers Falls, NY (US) (1996 - 1998)
  • Jericho, VT (US) (1999)
  • Fishkill, NY (US) (2002 - 2007)

Company Filing History:

goldMedal23 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal1 out of 832,680 
Other
 patents

Years Active: 1988-2007

where 'Filed Patents' based on already Granted Patents

24 patents (USPTO):
1. 7294565 - Method of fabricating a wire bond pad with Ni/Au metallization (2007-11-13),
2. 7098676 - Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor (2006-08-29),
3. 7009280 - Low-k interlevel dielectric layer (ILD) (2006-03-07),
4. 6815346 - Unique feature design enabling structural integrity for advanced low k semiconductor chips (2004-11-09),
5. 6650010 - Unique feature design enabling structural integrity for advanced low K semiconductor chips (2003-11-18),
6. 6531759 - Alpha particle shield for integrated circuit (2003-03-11),
7. 6486557 - Hybrid dielectric structure for improving the stiffness of back end of the line structures (2002-11-26),
8. 5872337 - Chip carrier and cable assembly reinforced at edges (1999-02-16),
9. 5789121 - High density template: materials and processes for the application of (1998-08-04),
10. 5709805 - Method for producing multi-layer circuit board and resulting article of (1998-01-20),
11. 5679444 - Method for producing multi-layer circuit board and resulting article of (1997-10-21),
12. 5626771 - Design of high density structures with laser etch stop (1997-05-06),
13. 5620782 - Method of fabricating a flex laminate package (1997-04-15),
14. 5536579 - Design of high density structures with laser etch stop (1996-07-16),
15. 5509196 - Method of fabricating a flex laminate package (1996-04-23),

Title: Spotlight on Inventor Charles Robert Davis from Fishkill, NY

Introduction

Charles Robert Davis from Fishkill, NY is a prolific inventor with 23 patents to his name, showcasing his innovative contributions to the field of semiconductor technology. One of his latest patents involves a cutting-edge method for fabricating wire bond pads with Ni/Au metallization, demonstrating his expertise in the industry.

Latest Patents

Among Charles Robert Davis's latest patents is a groundbreaking method for fabricating wire bond pads with Ni/Au metallization. This method involves the use of a protective coating such as TiN/Ti or TiN/Al cap to seal exposed surfaces of the wire bond pad, ensuring the prevention of chemical attacks during the deposition process. The innovative approach provides an effective electrical pathway while safeguarding the integrity of the bond pads.

Additionally, another notable patent by Charles Robert Davis entails a multi-functional structure designed to enhance chip manufacturability and reliability for low-k dielectric semiconductors. This structure includes an on-chip crack termination barrier, or crackstop, that acts as a shield against defects, cracks, and contaminants, thereby preserving the quality and longevity of semiconductor devices.

Career Highlights

Charles Robert Davis is a distinguished inventor who has made significant contributions to the technological advancements in semiconductor manufacturing. His expertise and innovative solutions have earned him recognition within the industry, exemplifying his commitment to excellence and cutting-edge research.

Collaborations

Throughout his career, Charles Robert Davis has collaborated with esteemed professionals in the field, including coworkers Ronald Dean Goldblatt and William Francis Landers. These collaborations have led to the development of groundbreaking technologies and solutions that have pushed the boundaries of innovation in semiconductor manufacturing.

Conclusion

Inventor Charles Robert Davis's remarkable journey in the realm of semiconductor technology is marked by a series of pioneering patents and collaborative efforts that have propelled the industry forward. His inventive spirit and dedication to excellence continue to inspire advancements in semiconductor manufacturing, showcasing his enduring impact on the field.

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