The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2007
Filed:
Oct. 01, 2003
Lloyd G. Burrell, Poughkeepsie, NY (US);
Charles R. Davis, Fishkill, NY (US);
Ronald D. Goldblatt, Yorktown Heights, NY (US);
William F. Landers, Wappingers Falls, NY (US);
Sanjay C. Mehta, Poughkeepsie, NY (US);
Lloyd G. Burrell, Poughkeepsie, NY (US);
Charles R. Davis, Fishkill, NY (US);
Ronald D. Goldblatt, Yorktown Heights, NY (US);
William F. Landers, Wappingers Falls, NY (US);
Sanjay C. Mehta, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for sealing an exposed surface of a wire bond pad with a material that is capable of preventing a possible chemical attack during electroless deposition of Ni/Au pad metallurgy is provided. Specifically, the present invention provides a method whereby a TiN/Ti or TiN/Al cap is used as a protective coating covering exposed surfaces of a wire bond pad. The TiN/Ti or TiN/Al cap is not affected by alkaline chemistries used in forming the Ni/Au metallization, yet it provides a sufficient electrical pathway connecting the bond pads to the Ni/Au pad metallization.