Poughkeepsie, NY, United States of America

Lloyd G Burrell



Average Co-Inventor Count = 4.9

ph-index = 5

Forward Citations = 95(Granted Patents)


Company Filing History:


Years Active: 2003-2025

where 'Filed Patents' based on already Granted Patents

10 patents (USPTO):

Title: **Lloyd G Burrell: An Innovator in Wafer-Scale Chip Packaging**

Introduction

Lloyd G Burrell is a notable inventor based in Poughkeepsie, NY, who has made significant contributions to the field of semiconductor packaging. With a total of nine patents to his name, Burrell is recognized for developing innovative methods that optimize the manufacture of co-planar wafer-scale chip packages. His pioneering work facilitates advancements in the integration of various chip fabrication processes, marking him as a leading figure in his industry.

Latest Patents

Among his latest innovations, Burrell's patent, "Methods for forming co-planar wafer-scale chip packages," stands out. This economical approach utilizes partial wafer bonding and partial wafer dicing techniques to create chips and corresponding pockets for these chips. The method allows for the mounting of finished chips into designated pockets of a carrier substrate while forming global interconnects on the planar surfaces. Notably, Burrell's method eliminates the need for traditional planarization processes, such as chemical-mechanical polishing, and ensures that all chips are aligned precisely, facing up, ready for global wiring without flipping them upside down.

Career Highlights

Burrell has had a successful career with significant tenures at renowned firms, including IBM and Infineon Technologies AG. His experience with these industry giants has enriched his perspective on semiconductor technology and innovative design practices, allowing him to contribute effectively to cutting-edge research and development efforts.

Collaborations

Throughout his career, Burrell has collaborated with other esteemed professionals in the semiconductor field, including Wolfgang Sauter and Kwong Hon Wong. These partnerships have not only enhanced his inventions but have also encouraged knowledge-sharing and innovation in the industry.

Conclusion

Lloyd G Burrell's commitment to innovation and excellence in the development of wafer-scale chip packages showcases his importance as an inventor. His methods have paved the way for advancements in the semiconductor industry, demonstrating the potential for future innovations that can further enhance performance and efficiency in electronic devices. As he continues to contribute to this dynamic field, Burrell remains a key figure to watch in the world of technology and innovation.

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