The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2003
Filed:
Jun. 28, 2001
Applicant:
Inventors:
Hans-Joachim Barth, Munich, DE;
Lloyd G. Burrell, Poughkeepsie, NY (US);
Gerald R. Friese, München, DE;
Michael Stetter, München, DE;
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/13205 ; H01L 2/182 ; H01L 2/144 ; H01L 2/1331 ; H01L 2/1326 ;
U.S. Cl.
CPC ...
H01L 2/13205 ; H01L 2/182 ; H01L 2/144 ; H01L 2/1331 ; H01L 2/1326 ;
Abstract
A process for forming fusible links in an integrated circuit includes forming the fusible link in the last metallization layer. The process can be employed in the fabrication of integrated circuits employing copper metallization and low k dielectric materials. The fusible link is formed in the last metallization layer and may be formed simultaneously with the bonding pad areas.