The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2007
Filed:
Feb. 23, 2005
Applicants:
Toyohiro Aoki, Yasu, JP;
Lloyd G. Burrell, Poughkeepsie, NY (US);
Wolfgang Sauter, Richmond, VT (US);
Inventors:
Toyohiro Aoki, Yasu, JP;
Lloyd G. Burrell, Poughkeepsie, NY (US);
Wolfgang Sauter, Richmond, VT (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A sensor for measuring cracks in a semiconductor device, such as a wafer and, more particularly, to a BEOL wirebond crack sensor for low-k dies or wafers, and a method of providing the wirebond crack sensor for low-k wafers or the like structures.