Toyohiro Aoki

This inventor holds 47 USPTO granted patents and 8 published patent applications, primarily in Semiconductor Packaging. Top assignees: International Business Machines Corporation, Adeia Semiconductor Bonding Technologies Inc.. Active years: 2007-2026.

USPTO Granted Patents = 47 (Patent Applications = 8)

% Patents Active = 87.2

Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 57(Granted Patents)

Location History:

Yasu, JP (2007)
Kawasaki, JP (2017 - 2020)
Yokohama, JP (2016 - 2023)
Kanagawa, JP (2019 - 2024)

Company Filing History:

46 out of 166,159

International Business Machines Corporation

patents

1 out of 1,904

Adeia Semiconductor Bonding Technologies Inc.

patents

Years Active: 2007-2026

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Areas of Expertise:

Solder Bump Structure

Interconnect Package

Injection Molded Solder

High Aspect Ratio

Chip Stacking

Electrodeposition Bonding

Flip Chip Joining

Bridge Chip Interconnection

Vacuum Process

Material Injection

Thermal Management

47 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12622284 - Solder volume for flip-chip bonding (2026-05-05),

2. 12456656 - Multichip interconnect package (2025-10-28),

3. 12354983 - Fine-pitch joining pad structure (2025-07-08),

4. 12315775 - Underfill vacuum process (2025-05-27),

5. 12183708 - Double resist structure for electrodeposition bonding (2024-12-31),

6. 12166008 - Injection molded solder head with improved sealing performance (2024-12-10),

7. 12142603 - Bonding of bridge to multiple semiconductor chips (2024-11-12),

8. 12094825 - Interconnection between chips by bridge chip (2024-09-17),

9. 11969828 - Prevention of dripping of material for material injection (2024-04-30),

10. 11848272 - Interconnection between chips by bridge chip (2023-12-19),

11. 11735575 - Bonding of bridge to multiple semiconductor chips (2023-08-22),

12. 11684988 - Prevention of dripping of material for material injection (2023-06-27),

13. 11329018 - Forming of bump structure (2022-05-10),

14. 11298769 - Prevention of dripping of material for material injection (2022-04-12),

15. 11181704 - Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump (2021-11-23),

Title: Toyohiro Aoki: Pioneering Inventor from Kawasaki

Introduction: Toyohiro Aoki is a renowned inventor hailing from Kawasaki, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Aoki holds several patents in the areas of robotics, artificial intelligence, and renewable energy, showcasing his continuous commitment to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Aoki has worked with leading tech companies in Japan, spearheading projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout his career, Aoki has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing.

Conclusion: Toyohiro Aoki's dedication to innovation and his relentless pursuit of excellence have solidified his position as a trailblazer in the world of technology, inspiring future generations of inventors and innovators.