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Kawasaki, Japan

Toyohiro Aoki

USPTO Granted Patents = 46 (Patent Applications = 6)

Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 55(Granted Patents)

Location History:

Yasu, JP (2007)
Kawasaki, JP (2017 - 2020)
Yokohama, JP (2016 - 2023)
Kanagawa, JP (2019 - 2024)

Company Filing History:

45 out of 164,197

International Business Machines Corporation

Adeia Semiconductor Bonding Technologies Inc.

Years Active: 2007-2025

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Areas of Expertise:

Multichip Interconnect Package

Fine-Pitch Joining Pad Structure

Underfill Vacuum Process

Electrodeposition Bonding

Injection Molded Solder

Solder Bump Structure

High Aspect Ratio Solder Bumping

Chip Stacking Techniques

Solder Joint Formation

Wireless Communication Devices

Pillar Solder Bump

Wirebond Crack Sensor

46 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12456656 - Multichip interconnect package (2025-10-28),

2. 12354983 - Fine-pitch joining pad structure (2025-07-08),

3. 12315775 - Underfill vacuum process (2025-05-27),

4. 12183708 - Double resist structure for electrodeposition bonding (2024-12-31),

5. 12166008 - Injection molded solder head with improved sealing performance (2024-12-10),

6. 12142603 - Bonding of bridge to multiple semiconductor chips (2024-11-12),

7. 12094825 - Interconnection between chips by bridge chip (2024-09-17),

8. 11969828 - Prevention of dripping of material for material injection (2024-04-30),

9. 11848272 - Interconnection between chips by bridge chip (2023-12-19),

10. 11735575 - Bonding of bridge to multiple semiconductor chips (2023-08-22),

11. 11684988 - Prevention of dripping of material for material injection (2023-06-27),

12. 11329018 - Forming of bump structure (2022-05-10),

13. 11298769 - Prevention of dripping of material for material injection (2022-04-12),

14. 11181704 - Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump (2021-11-23),

15. 11164845 - Resist structure for forming bumps (2021-11-02),

Title: Toyohiro Aoki: Pioneering Inventor from Kawasaki

Introduction: Toyohiro Aoki is a renowned inventor hailing from Kawasaki, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Aoki holds several patents in the areas of robotics, artificial intelligence, and renewable energy, showcasing his continuous commitment to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Aoki has worked with leading tech companies in Japan, spearheading projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout his career, Aoki has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing.

Conclusion: Toyohiro Aoki's dedication to innovation and his relentless pursuit of excellence have solidified his position as a trailblazer in the world of technology, inspiring future generations of inventors and innovators.

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