The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2022
Filed:
Oct. 23, 2019
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/05 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/11505 (2013.01); H01L 2224/11616 (2013.01); H01L 2224/13324 (2013.01); H01L 2224/13347 (2013.01); H01L 2224/13399 (2013.01);
Abstract
A technique for fabricating a bump structure is disclosed. A substrate that includes a set of pads formed on a surface thereof is prepared, in which the pads includes first conductive material. A metallic adhesion layer is coated on each pad. A bump base is formed on each pad by sintering conductive particles using a mold layer, in which the conductive particles includes second conductive material different from the first conductive material.