Takashi Hisada

This inventor holds 49 USPTO granted patents and 5 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: International Business Machines Corporation, A Factory Inc., Adeia Semiconductor Bonding Technologies Inc.. Active years: 2005-2026.

USPTO Granted Patents = 49 (Patent Applications = 5)

% Patents Active = 83.7

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 3.7

ph-index = 5

Forward Citations = 69(Granted Patents)

Location History:

Ritto-cho, JP (2005)
Shiga-ken, JP (2007)
Ritto, JP (2010)
Kawasaki, JP (2017 - 2020)
Hachiouji, JP (2009 - 2024)
Tokyo, JP (2010 - 2024)

Company Filing History:

46 out of 166,264

International Business Machines Corporation

Adeia Semiconductor Bonding Technologies Inc.

patents

4. 1 out of 1,173

Nippon Sheet Glass Company, Limited

patents

5. 1 out of 1

Tis & Partners Co., Ltd.

patent

where one patent can have more than one assignee

Years Active: 2005-2026

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Areas of Expertise:

Solder Bump Structure

Multichip Interconnects

Underfill Processes

Injection Molded Solder

Fine-Pitch Joining

Electrodeposition Bonding

Fluid Control Structure

High Aspect Ratio Bumping

Chip Stacking

Bridge Chip Interconnection

Stress Reduction

Solder Balls

49 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12622284 - Solder volume for flip-chip bonding (2026-05-05),

2. 12519061 - Multichip interconnect package fine jet underfill (2026-01-06),

3. 12456656 - Multichip interconnect package (2025-10-28),

4. 12354983 - Fine-pitch joining pad structure (2025-07-08),

5. 12315775 - Underfill vacuum process (2025-05-27),

6. 12183708 - Double resist structure for electrodeposition bonding (2024-12-31),

7. 12166008 - Injection molded solder head with improved sealing performance (2024-12-10),

8. 12142603 - Bonding of bridge to multiple semiconductor chips (2024-11-12),

9. 12094825 - Interconnection between chips by bridge chip (2024-09-17),

10. 11969828 - Prevention of dripping of material for material injection (2024-04-30),

11. 11908723 - Silicon handler with laser-release layers (2024-02-20),

12. 11848272 - Interconnection between chips by bridge chip (2023-12-19),

13. 11735575 - Bonding of bridge to multiple semiconductor chips (2023-08-22),

14. 11684988 - Prevention of dripping of material for material injection (2023-06-27),

15. 11329018 - Forming of bump structure (2022-05-10),

Title: The Innovative Journey of Takashi Hisada

Introduction: Takashi Hisada is a renowned inventor hailing from Kawasaki, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: His latest patents focus on advancements in robotics and artificial intelligence, showcasing his commitment to pushing the boundaries of modern technology.

Career Highlights: With over two decades of experience in the industry, Takashi Hisada has a proven track record of developing cutting-edge solutions that have revolutionized various sectors.

Collaborations: Throughout his career, Hisada has collaborated with leading tech companies and research institutions, fostering a culture of innovation and knowledge-sharing within the industry.

Conclusion: Takashi Hisada's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.