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Kawasaki, Japan

Takashi Hisada

USPTO Granted Patents = 47 (Patent Applications = 7)

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 3.7

ph-index = 4

Forward Citations = 67(Granted Patents)

Location History:

Ritto-cho, JP (2005)
Shiga-ken, JP (2007)
Ritto, JP (2010)
Kawasaki, JP (2017 - 2020)
Hachiouji, JP (2009 - 2024)
Tokyo, JP (2010 - 2024)

Company Filing History:

44 out of 164,197

International Business Machines Corporation

Nippon Sheet Glass Company, Limited

Adeia Semiconductor Bonding Technologies Inc.

Tis & Partners Co., Ltd.

where one patent can have more than one assignee

Years Active: 2005-2025

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Areas of Expertise:

Multichip Interconnect Package

Fine-Pitch Joining Pad Structure

Underfill Vacuum Process

Electrodeposition Bonding

Injection Molded Solder

Solder Bump Structure

High Aspect Ratio Solder Bumping

Flip Chip Joining

Fluid Control Structure

Semiconductor Packaging

Stress Reduction in Via Structure

Laser-Release Layers

47 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12456656 - Multichip interconnect package (2025-10-28),

2. 12354983 - Fine-pitch joining pad structure (2025-07-08),

3. 12315775 - Underfill vacuum process (2025-05-27),

4. 12183708 - Double resist structure for electrodeposition bonding (2024-12-31),

5. 12166008 - Injection molded solder head with improved sealing performance (2024-12-10),

6. 12142603 - Bonding of bridge to multiple semiconductor chips (2024-11-12),

7. 12094825 - Interconnection between chips by bridge chip (2024-09-17),

8. 11969828 - Prevention of dripping of material for material injection (2024-04-30),

9. 11908723 - Silicon handler with laser-release layers (2024-02-20),

10. 11848272 - Interconnection between chips by bridge chip (2023-12-19),

11. 11735575 - Bonding of bridge to multiple semiconductor chips (2023-08-22),

12. 11684988 - Prevention of dripping of material for material injection (2023-06-27),

13. 11329018 - Forming of bump structure (2022-05-10),

14. 11298769 - Prevention of dripping of material for material injection (2022-04-12),

15. 11181704 - Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump (2021-11-23),

Title: The Innovative Journey of Takashi Hisada

Introduction: Takashi Hisada is a renowned inventor hailing from Kawasaki, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: His latest patents focus on advancements in robotics and artificial intelligence, showcasing his commitment to pushing the boundaries of modern technology.

Career Highlights: With over two decades of experience in the industry, Takashi Hisada has a proven track record of developing cutting-edge solutions that have revolutionized various sectors.

Collaborations: Throughout his career, Hisada has collaborated with leading tech companies and research institutions, fostering a culture of innovation and knowledge-sharing within the industry.

Conclusion: Takashi Hisada's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

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