IDiyas

For the Inventor, By the Inventor

Kawasaki, Japan

Takashi Hisada

USPTO Granted Patents = 47 


Average Co-Inventor Count = 3.7

ph-index = 4

Forward Citations = 66(Granted Patents)


Location History:

  • Ritto-cho, JP (2005)
  • Shiga-ken, JP (2007)
  • Ritto, JP (2010)
  • Kawasaki, JP (2017 - 2020)
  • Hachiouji, JP (2009 - 2024)
  • Tokyo, JP (2010 - 2024)

Company Filing History:

goldMedal44 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal1 out of 1,156 
 
Nippon Sheet Glass Company, Limited
 patents
bronzeMedal1 out of 1,853 
 
Adeia Semiconductor Bonding Technologies Inc.
 patents
4. 1 out of 1 
 
Tis & Partners Co., Ltd.
 patent
5. 1 out of 1 
 
A Factory Inc.
 patent
where one patent can have more than one assignee

Years Active: 2005-2025

where 'Filed Patents' based on already Granted Patents

47 patents (USPTO):
1. 12456656 - Multichip interconnect package (2025-10-28),
2. 12354983 - Fine-pitch joining pad structure (2025-07-08),
3. 12315775 - Underfill vacuum process (2025-05-27),
4. 12183708 - Double resist structure for electrodeposition bonding (2024-12-31),
5. 12166008 - Injection molded solder head with improved sealing performance (2024-12-10),
6. 12142603 - Bonding of bridge to multiple semiconductor chips (2024-11-12),
7. 12094825 - Interconnection between chips by bridge chip (2024-09-17),
8. 11969828 - Prevention of dripping of material for material injection (2024-04-30),
9. 11908723 - Silicon handler with laser-release layers (2024-02-20),
10. 11848272 - Interconnection between chips by bridge chip (2023-12-19),
11. 11735575 - Bonding of bridge to multiple semiconductor chips (2023-08-22),
12. 11684988 - Prevention of dripping of material for material injection (2023-06-27),
13. 11329018 - Forming of bump structure (2022-05-10),
14. 11298769 - Prevention of dripping of material for material injection (2022-04-12),
15. 11181704 - Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump (2021-11-23),

Title: The Innovative Journey of Takashi Hisada

Introduction: Takashi Hisada is a renowned inventor hailing from Kawasaki, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: His latest patents focus on advancements in robotics and artificial intelligence, showcasing his commitment to pushing the boundaries of modern technology.

Career Highlights: With over two decades of experience in the industry, Takashi Hisada has a proven track record of developing cutting-edge solutions that have revolutionized various sectors.

Collaborations: Throughout his career, Hisada has collaborated with leading tech companies and research institutions, fostering a culture of innovation and knowledge-sharing within the industry.

Conclusion: Takashi Hisada's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

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