The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2025
Filed:
Sep. 11, 2022
International Business Machines Corporation, Armonk, NY (US);
Akihiro Horibe, Yokohama, JP;
Toyohiro Aoki, Yokohama, JP;
Chinami Marushima, Urayasu, JP;
Takahito Watanabe, Yokohama, JP;
Takashi Hisada, Hachiouji, JP;
International Business Machines Corporation, Armonk, NY (US);
Abstract
An interconnected semiconductor subassembly structure includes an interconnect structure; a first semiconductor die bonded to a first portion of a top surface of the interconnect structure; a second semiconductor die bonded to a second portion of the top surface of the interconnect structure; and a resin layer located within at least a first portion of a gap between the first semiconductor die and the second semiconductor die, wherein at least one of a top surface and a bottom surface of the resin layer located within the at least first portion of the gap has a concave meniscus shape.