Yokohama, Japan

Akihiro Horibe

This inventor holds 50 USPTO granted patents and 10 published patent applications, primarily in Solid State Batteries. Top assignees: International Business Machines Corporation, Adeia Semiconductor Bonding Technologies Inc.. Active years: 2004-2026.

USPTO Granted Patents = 50 

% Patents Active = 72.0

Average Co-Inventor Count = 2.7

ph-index = 4

Forward Citations = 92(Granted Patents)


Location History:

  • Yamato, JP (2004 - 2007)
  • Aoba-ku, JP (2009)
  • Kanagawa, JP (2018 - 2020)
  • Kawasaki, JP (2016 - 2021)
  • Kanagawa-ken, JP (2017 - 2022)
  • Yokohama, JP (2017 - 2024)

Company Filing History:


Years Active: 2004-2026

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Areas of Expertise:
Solid State Battery
Multichip Interconnect
Polymer Waveguide
High-Density Interconnection
Solder Fill
Underfill Process
Bridge Chip
Stacked Device Structure
Circuit Module
Semiconductor Chips
Wafer Scale Testing
Adhesive Tape
50 patents (USPTO):Explore Patents

Title: The Innovative Mind of Akihiro Horibe

Introduction

Akihiro Horibe, an esteemed inventor based in Yokohama, Japan, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 45 patents, Horibe has been at the forefront of innovations that enhance the functionality and efficiency of multi-chip assemblies. His work reflects a deep understanding of semiconductor bonding processes, which are crucial in modern electronics.

Latest Patents

Among his notable inventions, Horibe's latest patents showcase groundbreaking methods for interconnecting semiconductor chips. One patent describes the bonding of a bridge to multiple semiconductor chips, wherein a chip handler mounts the first and second chips, facilitating their interconnection through a bridge member. This inventive method involves techniques for accurately placing chips and connecting them via a bridge to enhance operational efficiency. Another patent outlines the fabrication of bridged multi-chip assembly structures, detailing a process that encompasses arranging chips on a carrier substrate, applying molding material, and bonding bridge chips to terminal sets of the integrated chips. These innovative approaches contribute to the advancement of multi-chip technology.

Career Highlights

Akihiro Horibe's career includes notable roles at leading technology companies such as International Business Machines Corporation (IBM) and Adeia Semiconductor Bonding Technologies Inc. His experiences at these organizations have allowed him to develop and refine his expertise in semiconductor technology and innovation.

Collaborations

Throughout his career, Horibe has collaborated with distinguished professionals in the field. Notable coworkers include Kuniaki Sueoka and Hiroyuki Mori, whose combined efforts have played a role in propelling advancements in semiconductor bonding techniques. These collaborations reflect the importance of teamwork in driving innovations within the technology sector.

Conclusion

Akihiro Horibe stands as a prominent figure in semiconductor innovation, with a strong patent portfolio that underscores his contributions to technology. His inventive methods for chip interconnection and assembly highlight his commitment to enhancing electronic efficiency. As the industry continues to evolve, Horibe's work will likely inspire future advancements in semiconductor technologies.

Profile summary based on public USPTO records.
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