The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
May. 07, 2019
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Akihiro Horibe, Kanagawa-ken, JP;
Kuniaki Sueoka, Kanagawa-ken, JP;
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 4/1391 (2010.01); H01M 4/131 (2010.01); H01M 10/0562 (2010.01); H01M 10/058 (2010.01); H01M 4/134 (2010.01);
U.S. Cl.
CPC ...
H01M 4/1391 (2013.01); H01M 4/131 (2013.01); H01M 4/134 (2013.01); H01M 10/058 (2013.01); H01M 10/0562 (2013.01);
Abstract
A method for fabricating a stacked device structure includes preparing plural device layers each having a glass layer, a metal layer, and a resin layer. The metal layer corresponds to one of plural metal layers. The method further includes stacking the plural device layers to compose stacked device layers; and drilling vertically a hole into the stacked device layers by laser such that the plural metal layers are exposed to the hole and filling conductive material into the hole to connect the plural metal layers.