The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2005
Filed:
Sep. 25, 2003
Lloyd G. Burrell, Poughkeepsie, NY (US);
Kwong H. Wong, Wappingers Falls, NY (US);
Adreanne A. Kelly, Poughkeepsie, NY (US);
Samuel R. Mcknight, New Paltz, NY (US);
Lloyd G. Burrell, Poughkeepsie, NY (US);
Kwong H. Wong, Wappingers Falls, NY (US);
Adreanne A. Kelly, Poughkeepsie, NY (US);
Samuel R. McKnight, New Paltz, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A semiconductor device, and a method of fabricating the device, having a copper wiring level and an aluminum bond pad above the copper wiring level. In addition to a barrier layer which is normally present to protect the copper wiring level, there is a composite layer between the aluminum bond pad and the barrier layer to make the aluminum bond pad more robust so as to withstand the forces of bonding and probing. The composite layer is a sandwich of a refractory metal and a refractory metal nitride.