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Poughkeepsie, NY, United States of America

Eric D Perfecto

USPTO Granted Patents = 60 (Patent Applications = 4)

Average Co-Inventor Count = 5.0

ph-index = 15

Forward Citations = 784(Granted Patents)

Forward Citations (Not Self Cited) = 773(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Wappingers Falls, NY (US) (1994 - 1999)
Yorktown Heights, NY (US) (2013)
Hopewell Junction, NY (US) (2012 - 2016)
Poughkeepsie, NY (US) (1996 - 2019)

Company Filing History:

48 out of 164,197

International Business Machines Corporation

11 out of 5,671

Globalfoundries Inc.

Globalfounries Inc.

Years Active: 1994-2025

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Areas of Expertise:

Resist Patterned Redistribution Wiring

Infrared Debond Damage Mitigation

Chip-to-Chip Interconnections

Electrodeposition Systems

Thin Interposers

Electromigration-Resistant Solder

Universal Solder Joints

Organic Coating for Solder Wetting

Three Dimensional Stacked Package

Low Stress Hermetic Seal

Corrosion-Resistant Terminal Metal Pads

Thin Film Electronic Packaging

60 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12469787 - Resist patterned redistribution wiring on copper polyimide via layer (2025-11-11),

2. 12300615 - Infrared debond damage mitigation by copper fill pattern (2025-05-13),

3. 10438894 - Chip-to-chip and chip-to-substrate interconnections in multi-chip semiconductor devices (2019-10-08),

4. 10041183 - Electrodeposition systems and methods that minimize anode and/or plating solution degradation (2018-08-07),

5. 10002835 - Structure for establishing interconnects in packages using thin interposers (2018-06-19),

6. 9853006 - Semiconductor device contact structure having stacked nickel, copper, and tin layers (2017-12-26),

7. 9728440 - Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer (2017-08-08),

8. 9689084 - Electrodeposition systems and methods that minimize anode and/or plating solution degradation (2017-06-27),

9. 9607973 - Method for establishing interconnects in packages using thin interposers (2017-03-28),

10. 9576922 - Silver alloying post-chip join (2017-02-21),

11. 9396991 - Multilayered contact structure having nickel, copper, and nickel-iron layers (2016-07-19),

12. 9379007 - Electromigration-resistant lead-free solder interconnect structures (2016-06-28),

13. 9343420 - Universal solder joints for 3D packaging (2016-05-17),

14. 9324669 - Use of electrolytic plating to control solder wetting (2016-04-26),

15. 9190376 - Organic coating to inhibit solder wetting on pillar sidewalls (2015-11-17),

Title: The Innovative Journey of Eric D Perfecto

Introduction: Eric D Perfecto, a talented inventor hailing from Poughkeepsie, NY, has made significant contributions to the world of technology through his groundbreaking inventions and patents.

Latest Patents: Eric D Perfecto's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, as well as a patented method for enhancing the efficiency of solar panels to harness renewable energy more effectively.

Career Highlights: With a career spanning over two decades, Eric D Perfecto has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions. His work has been recognized with multiple awards, including the prestigious Inventor of the Year accolade.

Collaborations: Throughout his career, Eric D Perfecto has collaborated with leading tech companies, research institutions, and universities to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has led to the successful commercialization of several groundbreaking technologies.

Conclusion: Eric D Perfecto's passion for innovation and his relentless drive to push the boundaries of what is possible have cemented his reputation as a pioneering inventor in the field of technology. His contributions continue to inspire the next generation of inventors to dream big and create a better future for all.

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