The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Feb. 21, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Mukta Ghate Farooq, Hopwell Junction, NY (US);

James J. Kelly, Schenectady, NY (US);

Eric Perfecto, Poughkeepsie, NY (US);

Spyridon Skordas, Troy, NY (US);

Dale Curtis Mcherron, Staatsburg, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 21/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5329 (2013.01); H01L 21/02118 (2013.01); H01L 24/05 (2013.01); H01L 2224/024 (2013.01); H01L 2924/01029 (2013.01);
Abstract

A semiconductor element includes a conductive pad. The semiconductor element further includes a first layer of a first polyimide material having an uppermost surface. The first layer includes a via trench extending through the first layer from the uppermost surface to the conductive pad. The semiconductor element further includes a second layer of a second polyimide material arranged in direct contact with the uppermost surface. The second layer includes a line trench extending to the uppermost surface. The semiconductor element further includes a conductive structure arranged in the via trench and the line trench such that copper is in direct contact with the second polyimide material.


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