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For the Inventor, By the Inventor

Staatsburg, NY, United States of America

Dale Curtis McHerron

USPTO Granted Patents = 14 

Average Co-Inventor Count = 4.2

ph-index = 7

Forward Citations = 192(Granted Patents)


Location History:

  • Modena, NY (US) (1998 - 2000)
  • Staatsburg, NY (US) (1999 - 2023)

Company Filing History:

goldMedal14 out of 164,197 
 
International Business Machines Corporation
 patents

Years Active: 1998-2025

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14 patents (USPTO):Explore Patents
1. 12469787 - Resist patterned redistribution wiring on copper polyimide via layer (2025-11-11),
2. 11791270 - Direct bonded heterogeneous integration silicon bridge (2023-10-17),
3. 11355379 - Oxide-bonded wafer pair separation using laser debonding (2022-06-07),
4. 10991635 - Multiple chip bridge connector (2021-04-27),
5. 7475368 - Deflection analysis system and method for circuit design (2009-01-06),
6. 6892781 - Method and apparatus for application of pressure to a workpiece by thermal expansion (2005-05-17),
7. 6518392 - Dielectric compositions, preparation thereof, and integrated circuit devices fabricated therewith (2003-02-11),
8. 6342455 - Process for forming an integrated circuit (2002-01-29),
9. 6265753 - Interconnect dielectric compositions, preparation thereof, and integrated circuit devices fabricated therewith (2001-07-24),
10. 6262390 - Repair process for aluminum nitride substrates (2001-07-17),
11. 6174175 - High density Z-axis connector (2001-01-16),
12. 6046074 - Hermetic thin film metallized sealband for SCM and MCM-D modules (2000-04-04),
13. 5977787 - Large area multiple-chip probe assembly and method of making the same (1999-11-02),
14. 5744752 - Hermetic thin film metallized sealband for SCM and MCM-D modules (1998-04-28),

Title: The Innovative Contributions of Dale Curtis McHerron

Introduction

Dale Curtis McHerron, based in Staatsburg, NY, is an accomplished inventor with a remarkable portfolio of 13 patents. Known for her groundbreaking work in semiconductor technology, McHerron has significantly contributed to innovative solutions that enhance electronic devices and systems.

Latest Patents

Among her latest patents are two notable inventions:

1. **Direct Bonded Heterogeneous Integration Silicon Bridge** - This innovative device features a substrate with a trench, facilitating the coupling of two chips via a suspension bridge. The architecture enhances connectivity and functionality, showcasing a leap forward in semiconductor integration.

2. **Oxide-Bonded Wafer Pair Separation Using Laser Debonding** - McHerron's method of fabricating a semiconductor structure involves creating a scissionable layer that absorbs infrared radiation, enabling efficient separation of wafers. This technique is essential for improving the manufacturing process of semiconductor devices.

Career Highlights

Dale McHerron has made significant strides in her career, working with the renowned International Business Machines Corporation (IBM). Her contributions have not only advanced her professional journey but have also played a pivotal role in the evolution of semiconductor technologies.

Collaborations

Throughout her career, McHerron has collaborated with other talented professionals, including Kenneth Raymond Carter and James L. Hedrick. These collaborations have fostered an environment of innovation and creativity, allowing her to develop cutting-edge solutions in her field.

Conclusion

Dale Curtis McHerron stands out as a leading innovator in semiconductor technology. With a strong record of patents and collaborations, she continues to influence the industry with her innovative ideas. Her work exemplifies the essence of innovation in today's technological landscape, ensuring a brighter future for electronic devices and systems.

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