The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 1999
Filed:
Jun. 16, 1997
Gobina Das, Hopewell Junction, NY (US);
Paul Mathew Gaschke, Wappingers Falls, NY (US);
Suryanarayan G Hegde, Hollowville, NY (US);
Mark Raymond LaForce, Essex Junction, VT (US);
Dale Curtis McHerron, Staatsburg, NY (US);
Charles Hampton Perry, Poughkeepsie, NY (US);
Frederick L Taber, Jr, LaGrangeville, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A multiple-chip probe assembly suitable for wafer testing over a wide temperature range includes a plurality of individual buckling beam probe elements. A support structure supports the plurality of buckling beam probe elements in an arrangement in accordance with an electrical contact footprint for use in electrically contacting multiple chips of a wafer under test and enables buckling movement in a contacting direction of the plurality of buckling beams. The support structure includes a principal support material having a thermal coefficient of expansion (TCE) matched with the wafer under test and a second material other than the principal support material, wherein a contact positioning of the plurality of buckling beam probe elements upon the wafer under test during a testing operation is maintained. The second material prevents an individual probe element from electrically contacting the principal support material.