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For the Inventor, By the Inventor

Wappingers Falls, NY, United States of America

Paul M Gaschke

USPTO Granted Patents = 12

Average Co-Inventor Count = 3.0

ph-index = 9

Forward Citations = 386(Granted Patents)


Location History:

  • Pleasantville, NY (US) (1991 - 1993)
  • Wappinger Falls, NY (US) (2001)
  • Wappingers Falls, NY (US) (1999 - 2008)

Company Filing History:

goldMedal12 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1991-2008

where 'Filed Patents' based on already Granted Patents

12 patents (USPTO):
1. 7332927 - Apparatus for temporary thermal coupling of an electronic device to a heat sink during test (2008-02-19),
2. 7259580 - Method and apparatus for temporary thermal coupling of an electronic device to a heat sink during test (2007-08-21),
3. 6967556 - High power space transformer (2005-11-22),
4. 6426636 - Wafer probe interface arrangement with nonresilient probe elements and support structure (2002-07-30),
5. 6411112 - Off-axis contact tip and dense packing design for a fine pitch probe (2002-06-25),
6. 6275051 - Segmented architecture for wafer test and burn-in (2001-08-14),
7. 6196866 - Vertical probe housing (2001-03-06),
8. 6086387 - Cover assembly for a socket adaptable to IC modules of varying thickness (2000-07-11),
9. 5977787 - Large area multiple-chip probe assembly and method of making the same (1999-11-02),
10. 5186238 - Liquid film interface cooling chuck for semiconductor wafer processing (1993-02-16),
11. 5088006 - Liquid film interface cooling system for semiconductor wafer processing (1992-02-11),
12. 5001423 - Dry interface thermal chuck temperature control system for semiconductor (1991-03-19),

Title: The Innovative Contributions of Paul M. Gaschke

Introduction

Paul M. Gaschke is a notable inventor based in Wappingers Falls, NY (US). He has made significant contributions to the field of electronics, particularly in the area of thermal coupling for electronic devices. With a total of 12 patents to his name, Gaschke's work has had a substantial impact on the testing and performance of integrated circuits.

Latest Patents

Gaschke's latest patents include an "Apparatus for temporary thermal coupling of an electronic device to a heat sink during test." This invention outlines a method, system, and apparatus for testing an integrated circuit chip. The system involves forming a liquid polyalphaolefine layer on the bottom surface of the chip, allowing for effective thermal coupling with a heat sink during testing. Another significant patent is the "Method and apparatus for temporary thermal coupling of an electronic device to a heat sink during test." This method includes steps for forming a temporary liquid heat transfer layer, placing a heat sink in contact with the layer, and subsequently testing the electronic device.

Career Highlights

Gaschke is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and develop new technologies. His work at IBM has allowed him to explore various aspects of electronic device testing and thermal management.

Collaborations

Throughout his career, Gaschke has collaborated with notable colleagues, including David Lewis Gardell and Santiago E. Del Puerto. These collaborations have contributed to the advancement of technology in their respective fields.

Conclusion

Paul M. Gaschke's contributions to the field of electronics through his innovative patents and work at IBM highlight his importance as an inventor. His advancements in thermal coupling methods are paving the way for improved testing processes in electronic devices.

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