Gobina Das

Title: Gobina Das: Innovator in Probe Assembly Technology

Introduction

Gobina Das is a notable inventor based in Hopewell Junction, NY (US). He has made significant contributions to the field of probe assembly technology, particularly in the area of wafer testing. His innovative approach has led to the development of a unique patent that enhances the efficiency and effectiveness of testing multiple chips.

Latest Patents

Gobina Das holds a patent for a "Large area multiple-chip probe assembly and method of making the same." This invention features a multiple-chip probe assembly that is suitable for wafer testing over a wide temperature range. The assembly includes a plurality of individual buckling beam probe elements, which are supported by a structure that aligns with the electrical contact footprint necessary for testing multiple chips on a wafer. The design allows for buckling movement in the contacting direction, ensuring reliable electrical contact during testing operations. The support structure is made from a principal support material that has a thermal coefficient of expansion matched with the wafer under test, along with a second material that prevents individual probe elements from contacting the principal support material.

Career Highlights

Gobina Das is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and contribute to advancements in technology. His work has been instrumental in improving the processes involved in wafer testing, making it more efficient and reliable.

Collaborations

Throughout his career, Gobina has collaborated with esteemed colleagues such as Paul M Gaschke and Suryanarayan G Hegde. These collaborations have further enriched his work and contributed to the development of cutting-edge technologies in the field.

Conclusion

Gobina Das is a distinguished inventor whose work in probe assembly technology has made a significant impact on the industry. His innovative patent and contributions at IBM highlight his dedication to advancing technology and improving testing methodologies.